| DC Char ATE Test Engineer, up to Sr. | Qualcomm | Hsinchu | 2026-07-14 |
| Digital Product Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| IC Package Design Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Test Development (TD) Senior Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Senior Display Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Director of Engineering (Networking Product) | Qualcomm | Hsinchu | 2026-07-14 |
| Data Center Supplier Quality Engineer, Staff to Snr Staff | Qualcomm | Hsinchu | 2026-07-14 |
| Package/System Design Solution Engineer, Up to Senior | Qualcomm | Hsinchu | 2026-07-14 |
| ASICS Design Engineer, Senior to Staff | Qualcomm | Hsinchu | 2026-07-14 |
| ASIC DV Engineer, Principal/Mgr | Qualcomm | Hsinchu | 2026-07-14 |
| ASICS DV Engineer, Senior to Sr Staff | Qualcomm | Hsinchu | 2026-07-14 |
| ASICS Arch VI Engineer, Senior to Sr Staff | Qualcomm | Hsinchu | 2026-07-14 |
| Advanced Packaging & Assembly Yield Analytics Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| IC Package Layout Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| 3DIC Yield Analytics & Diagnostics Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| ASICS Design Engineer, Principal Manager | Qualcomm | Hsinchu | 2026-07-14 |
| Thermal Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Package/System Design Engineer (PMIC SIP and Module) | Qualcomm | Hsinchu | 2026-07-14 |
| Alpha Wave IPG Tech Silicon Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| Baseband Design Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| Customer Quality Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| SLT Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| Central Hardware Systems โ EE Automation Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| New Product Introduction (NPI) and Return Material Authorization (RMA) Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Data Analytics Director, Engineering (Zhubei) | Qualcomm | Hsinchu | 2026-07-14 |
| Digital Product and Test Development Engineer, up to Senior | Qualcomm | Hsinchu | 2026-07-14 |
| Senior AI Engineer โ Depth Estimation and Dense Scene Understanding | Qualcomm | Hsinchu | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Director, Silicon Design Engineering | AMD | Hsinchu | 2026-07-14 |
| Packaging Engineer | AMD | Hsinchu | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Packaging Engineer | AMD | Hsinchu | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Manager Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Packaging Thermal Engineerhybrid | Intel | Hsinchu | 2026-07-14 |
| R&D Engineer Fab Process | Broadcom | Hsinchu | 2026-07-14 |
| Substrate Engineer | Broadcom | Hsinchu | 2026-07-14 |
| Environmental Engineer | Haleon | Hsinchu | 2026-07-09 |
| Technical NPI Engineer | STMicroelectronics | Hsinchu | 2026-07-08 |
| Technical NPI Engineer-Assembling | STMicroelectronics | Hsinchu | 2026-07-08 |
| BE Operation Engineer | STMicroelectronics | Hsinchu | 2026-07-08 |
| Manufacturing Planning Senior Engineer | STMicroelectronics | Hsinchu | 2026-07-08 |
| Field Service Engineerremote | Sartorius Stedim Biotech | Hsinchu | 2026-07-08 |
| Lead Mechanical Engineer | Logitech | Hsinchu | 2026-07-08 |
| Lead Test Development Engineer | Logitech | Hsinchu | 2026-07-08 |
| Senior Material Engineer | Logitech | Hsinchu | 2026-07-08 |
| Senior User Experience Designer | Logitech | Hsinchu | 2026-07-08 |
| Product Compliance Engineer | Logitech | Hsinchu | 2026-07-08 |
| Senior Mechanical Engineerhybrid | Logitech | Hsinchu | 2026-07-08 |