| Staff Engineer, APTD Photolithography | Micron Technology | Boise, United States | 2026-07-14 |
| SR ENGINEER, APTD Dry Etch Process | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Principal Engineer, FE OCT CPEE ADT BOND | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Node Development PE | Micron Technology | Boise, United States | 2026-07-14 |
| Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory) | Micron Technology | Singapore, Singapore | 2026-07-14 |
| FAB Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Staff Engineer, GFAC US - Mech | Micron Technology | Boise, United States | 2026-07-14 |
| ATE Process Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Semiconductor Process Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| ENGINEER, ID1 DRAM PI | Micron Technology | Boise, United States | 2026-07-14 |
| Sr Engineer - Operations Improvement | Micron Technology | Boise, United States | 2026-07-14 |
| MTB IE Cost Engineer | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Senior Wet Etch Equipment Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Diffusion Equipment Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Senior Diffusion Process Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Wet Etch Process Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Shift Equipment Engineer | Micron Technology | Manassas, United States | 2026-07-14 |
| Engineer - Operations Improvement | Micron Technology | Boise, United States | 2026-07-14 |
| Shift Engineer, MTB PWF BOND | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Jr/Sr Engineer, STPG PE System | Micron Technology | Malaysia | 2026-07-14 |
| Staff Engineer , Analog Design | Micron Technology | Bengaluru, India | 2026-07-14 |
| HBM Sr RTL Engineer | Micron Technology | Richardson, United States | 2026-07-14 |
| RAM RDA Applications Engineer | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Principal SSD Systems Design Engineer | Micron Technology | Longmont, United States | 2026-07-14 |
| Staff SSD Systems Design Engineer | Micron Technology | Longmont, United States | 2026-07-14 |
| Operational Excellence & TPM Engineer - Global Facilities Standardization | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Senior Engineer in Product Engineering, NAND Validation | Micron Technology | Singapore, Singapore | 2026-07-14 |
| ่ฃฝ็จๅฎๅ
จๅทฅ็จๅธซ | Micron Technology | Taoyuan, Taiwan | 2026-07-14 |
| Principal Engineer- HIG HBM Layout | Micron Technology | Hyderabad, India | 2026-07-14 |
| ENGINEER, FW & PRODUCT TEST ENGINEERING | Micron Technology | Arzano, Italy | 2026-07-14 |
| Intern - AI / Data Science Engineering | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Principal Engineer, Films - Procurement and Operations Central Team Advanced Development | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Test Engineer Assistant | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Staff / Senior Security Engineer, Firmware Test, SSD | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Graduate Engineering Technician | Micron Technology | Sฤnand, India | 2026-07-14 |
| Senior Manager, F10 Construction | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Staff/ Principal Engineer, CMOS Process Integration, NTI | Micron Technology | Singapore, Singapore | 2026-07-14 |
| PDE PIE (Package Integration Engineering) Senior Engineer/Engineer | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Sr. Category Supplier Manager II, Construction Facilities Procurement | Micron Technology | United States | 2026-07-14 |
| Engineer, HIG HBM | Micron Technology | Singapore, Singapore | 2026-07-14 |
| INDUSTRIAL SAFETY ENGINEER | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Senior DRAM Design Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| New College Grad - DRAM Design Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Staff Engineer, Adv DRAM PI | Micron Technology | Boise, United States | 2026-07-14 |
| Senior or Staff Engineer, Advanced Modeling & AI Solutions | Micron Technology | Boise, United States | 2026-07-14 |
| DRAM Process Integration Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Sr Engineer, Adv DRAM PI | Micron Technology | Boise, United States | 2026-07-14 |
| CH Engineer | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| CH Engineer | Micron Technology | Taoyuan, Taiwan | 2026-07-14 |