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โ† Semiconductors overview

14,665 open jobs โ€” Semiconductors

Every open role at organisations of this kind, newest first. Each links to the employer's own career site.

All rolesEngineering & R&D (14,665)Software & IT (4,086)Production & Operations (2,186)Other Management/Specialist (1,241)Supply Chain & Logistics (825)Project & Product (603)Sales & Business Dev (496)Finance & Accounting (408)Internship & Graduate (326)Marketing & Comms (310)Management & Exec (254)HR & People (250)
RoleEmployerPlacePosted
Staff Engineer, APTD PhotolithographyMicron TechnologyBoise, United States2026-07-14
SR ENGINEER, APTD Dry Etch ProcessMicron TechnologyTaichung, Taiwan2026-07-14
Principal Engineer, FE OCT CPEE ADT BONDMicron TechnologySingapore, Singapore2026-07-14
Engineer, Node Development PEMicron TechnologyBoise, United States2026-07-14
Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)Micron TechnologySingapore, Singapore2026-07-14
FAB EngineerMicron TechnologyBoise, United States2026-07-14
Staff Engineer, GFAC US - MechMicron TechnologyBoise, United States2026-07-14
ATE Process EngineerMicron TechnologyBoise, United States2026-07-14
Semiconductor Process EngineerMicron TechnologyBoise, United States2026-07-14
ENGINEER, ID1 DRAM PIMicron TechnologyBoise, United States2026-07-14
Sr Engineer - Operations ImprovementMicron TechnologyBoise, United States2026-07-14
MTB IE Cost EngineerMicron TechnologyTaichung, Taiwan2026-07-14
Senior Wet Etch Equipment EngineerMicron TechnologyBoise, United States2026-07-14
Diffusion Equipment EngineerMicron TechnologyBoise, United States2026-07-14
Senior Diffusion Process EngineerMicron TechnologyBoise, United States2026-07-14
Wet Etch Process EngineerMicron TechnologyBoise, United States2026-07-14
Shift Equipment EngineerMicron TechnologyManassas, United States2026-07-14
Engineer - Operations ImprovementMicron TechnologyBoise, United States2026-07-14
Shift Engineer, MTB PWF BONDMicron TechnologyTaichung, Taiwan2026-07-14
Jr/Sr Engineer, STPG PE SystemMicron TechnologyMalaysia2026-07-14
Staff Engineer , Analog DesignMicron TechnologyBengaluru, India2026-07-14
HBM Sr RTL EngineerMicron TechnologyRichardson, United States2026-07-14
RAM RDA Applications EngineerMicron TechnologyTaichung, Taiwan2026-07-14
Principal SSD Systems Design EngineerMicron TechnologyLongmont, United States2026-07-14
Staff SSD Systems Design EngineerMicron TechnologyLongmont, United States2026-07-14
Operational Excellence & TPM Engineer - Global Facilities StandardizationMicron TechnologySingapore, Singapore2026-07-14
Senior Engineer in Product Engineering, NAND ValidationMicron TechnologySingapore, Singapore2026-07-14
่ฃฝ็จ‹ๅฎ‰ๅ…จๅทฅ็จ‹ๅธซMicron TechnologyTaoyuan, Taiwan2026-07-14
Principal Engineer- HIG HBM LayoutMicron TechnologyHyderabad, India2026-07-14
ENGINEER, FW & PRODUCT TEST ENGINEERINGMicron TechnologyArzano, Italy2026-07-14
Intern - AI / Data Science EngineeringMicron TechnologySingapore, Singapore2026-07-14
Principal Engineer, Films - Procurement and Operations Central Team Advanced DevelopmentMicron TechnologyHiroshima, Japan2026-07-14
Test Engineer AssistantMicron TechnologyTaichung, Taiwan2026-07-14
Staff / Senior Security Engineer, Firmware Test, SSDMicron TechnologySingapore, Singapore2026-07-14
Graduate Engineering TechnicianMicron TechnologySฤnand, India2026-07-14
Senior Manager, F10 ConstructionMicron TechnologySingapore, Singapore2026-07-14
Staff/ Principal Engineer, CMOS Process Integration, NTIMicron TechnologySingapore, Singapore2026-07-14
PDE PIE (Package Integration Engineering) Senior Engineer/EngineerMicron TechnologySingapore, Singapore2026-07-14
Sr. Category Supplier Manager II, Construction Facilities ProcurementMicron TechnologyUnited States2026-07-14
Engineer, HIG HBMMicron TechnologySingapore, Singapore2026-07-14
INDUSTRIAL SAFETY ENGINEERMicron TechnologyTaichung, Taiwan2026-07-14
Senior DRAM Design EngineerMicron TechnologyBoise, United States2026-07-14
New College Grad - DRAM Design EngineerMicron TechnologyBoise, United States2026-07-14
Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product EngineeringMicron TechnologySingapore, Singapore2026-07-14
Staff Engineer, Adv DRAM PIMicron TechnologyBoise, United States2026-07-14
Senior or Staff Engineer, Advanced Modeling & AI SolutionsMicron TechnologyBoise, United States2026-07-14
DRAM Process Integration EngineerMicron TechnologyBoise, United States2026-07-14
Sr Engineer, Adv DRAM PIMicron TechnologyBoise, United States2026-07-14
CH EngineerMicron TechnologyTaichung, Taiwan2026-07-14
CH EngineerMicron TechnologyTaoyuan, Taiwan2026-07-14
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