| Staff System Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen) | Micron Technology | Boise, United States | 2026-07-14 |
| Field Applications Engineer | Micron Technology | Taipei, Taiwan | 2026-07-14 |
| Photo Equipment Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| SR ENGINEER, APTD PHOTO Process | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Semiconductor Facilities Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Staff Design Engineer - HBM Design | Micron Technology | Richardson, United States | 2026-07-14 |
| Principal Verification Engineer, Design | Micron Technology | Hyderabad, India | 2026-07-14 |
| E5_MTS_SMTS NAND Design Rule Engineer in Process Integration | Micron Technology | Singapore, Singapore | 2026-07-14 |
| QMS Engineer | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| SR. Automation System Integration Engineer | Micron Technology | United States | 2026-07-14 |
| CMP Process Engineer | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| ENGINEER, GQ OPS - RELIABILITY PROCESS | Micron Technology | Singapore, Singapore | 2026-07-14 |
| ENGINEER, F16 PVD EQUIPMENT | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Package Health Yield (Senior/Staff/Principal) Engineer, APTD | Micron Technology | Singapore, Singapore | 2026-07-14 |
| STAFF ENGINEER, ASIC Design | Micron Technology | Hyderabad, India | 2026-07-14 |
| Sr AMS Layout Engineer-DPG-LPDDR | Micron Technology | Hyderabad, India | 2026-07-14 |
| Engineer/ Sr Memory Layout Engineer-DPG-LPDDR | Micron Technology | Hyderabad, India | 2026-07-14 |
| Firmware Engineer Data Center Solid State Drives | Micron Technology | Arzano, Italy | 2026-07-14 |
| Staff engineer , ASIC AMS Verification | Micron Technology | United States | 2026-07-14 |
| ENGINEER, DESIGN | Micron Technology | Avezzano, Italy | 2026-07-14 |
| New College Grad - Computer Engineer, Engineering Automation | Micron Technology | Richardson, United States | 2026-07-14 |
| Dry Etch Principal Process Development Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Principal Product Quality Engineering | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| ENGINEER - FAC TOOL INSTALL | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Design/Senior Design Engineer โ NAND Core (NVE Engineering) | Micron Technology | Avezzano, Italy | 2026-07-14 |
| GLOBAL FE PLANNING MODELING ENGINEER | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| GLOBAL FE PLANNING MODELING SNR/ENGINEER | Micron Technology | Singapore, Singapore | 2026-07-14 |
| ENGINEER, DESIGN | Micron Technology | Avezzano, Italy | 2026-07-14 |
| ENGINEER, DEMQRA AUTOMOTIVE PQRE | Micron Technology | United States | 2026-07-14 |
| Principal/MTS Wet Process Development Engineer, DRAM Wet Process (Evergreen) | Micron Technology | Boise, United States | 2026-07-14 |
| Engineer, Design | Micron Technology | Avezzano, Italy | 2026-07-14 |
| Design layout Engineer | Micron Technology | Avezzano, Italy | 2026-07-14 |
| ENGINEER, APTD FILM process | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Engineer, STPG PE | Micron Technology | Austria | 2026-07-14 |
| ENGINEER, APTD Bonding process | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Semiconductor Change Management Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| ENGINEER, APTD Wafer Thinning / CMP process | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| SMTS Process Engineer, RET OPC | Micron Technology | Boise, United States | 2026-07-14 |
| PROCT ADT Equipment Staff Engineer/ Principal (Dry Etch | Deposition CVD/PVD/Diffusion | CMP | Wet) | Micron Technology | Boise, United States | 2026-07-14 |
| ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION | Micron Technology | Singapore, Singapore | 2026-07-14 |
| ID1 Dry Etch Shift PE Engineer | Micron Technology | Taoyuan, Taiwan | 2026-07-14 |
| Principal Engineer - Metals/Implant, Operations Central Teams - Advanced Development Team | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Principal Engineer - Dry Etch, Operations Central Teams - Advanced Development Team | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| PRINCIPAL ENGINEER - PROCT ADT PEE REG E | Micron Technology | Boise, United States | 2026-07-14 |
| Principal Engineer, Films/Diffusion - Procurement and Operations Central Team Advanced Development | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Server ODM Field Applications Engineer | Micron Technology | Taipei, Taiwan | 2026-07-14 |
| Engineer, Process Integration | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Fab10 Facilities Construction Document and Cost Control Engineer | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) | Micron Technology | Singapore, Singapore | 2026-07-14 |