| PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS | Micron Technology | United States | 2026-07-14 |
| PRINCIPAL ENGINEER โ FE OCT CPEE HVM DRY ETCH | Micron Technology | United States | 2026-07-14 |
| Staff / Principal Spares Engineer, Operations Central Team | Micron Technology | United States | 2026-07-14 |
| Engineer, Yield Enhancement | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Process Integration | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Facilities Tool Install | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Facilities Mechanical | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Facilities Electrical | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Facilities Operation | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Sr. Node Development Product Engineer - DRAM Technology | Micron Technology | Boise, United States | 2026-07-14 |
| AMHS Robotics Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Principal Engineer, Firmware & Product Test | Micron Technology | Longmont, United States | 2026-07-14 |
| Global Engineering Lab (GEL) Equipment Maintenance Technician | Micron Technology | Boise, United States | 2026-07-14 |
| Staff/ Principal Engineer, FE OCT Spares Engrg | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Engineer, Environment Health Safety - Safety | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Engineer, Yield Enhancement | Micron Technology | Singapore, Singapore | 2026-07-14 |
| New College Grad - Design Engineer, DRAM Technology and Products | Micron Technology | Boise, United States | 2026-07-14 |
| SoC Physical Verification Engineer, HBM | Micron Technology | United States | 2026-07-14 |
| ENGINEER - PD SG CMP | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Principal Engineer / MTS โ NAND Process Pathfinding - Thin Films | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Senior Engineer, HIG HBM Media Health | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| OMT IE PMO ENGINEER Using AI | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Principal Engineer / MTS โ NAND Process Pathfinding โ Dry Etch | Micron Technology | Singapore, Singapore | 2026-07-14 |
| GLOBAL FE PLANNING MODELING ENGINEER | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Principal Engineer โ NAND Process Pathfinding โ Dry Etch | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Senior Engineer, Advanced Structure and Stress Modeling | Micron Technology | Hyderabad, India | 2026-07-14 |
| Engineer, GQ OPS -REL Process | Micron Technology | Austria | 2026-07-14 |
| Senior Engineer, Advanced Structural Modeling | Micron Technology | Hyderabad, India | 2026-07-14 |
| ENGINEER - GEL | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Tool Install Engineer | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Operations Performance & Analytics Engineer | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Senior Engineer, Advanced Process Modeling | Micron Technology | Hyderabad, India | 2026-07-14 |
| F15 IE Planning Engineer | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Process & Equipment Engineer | Micron Technology | Singapore, Singapore | 2026-07-14 |
| HBM Process Engineer | Micron Technology | Taichung, Taiwan | 2026-07-14 |
| Senior Engineer, Global Facilities US - Water/Wastewater | Micron Technology | United States | 2026-07-14 |
| Test Engineer | Micron Technology | Singapore, Singapore | 2026-07-14 |
| TSE TE OPS Engineer | Micron Technology | Austria | 2026-07-14 |
| Engineer, HIG HBM LAYOUT | Micron Technology | Hyderabad, India | 2026-07-14 |
| Principal Design Engineer | Micron Technology | San Jose, United States | 2026-07-14 |
| Senior DRAM Security Test Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Senior Design Engineer | Micron Technology | San Jose, United States | 2026-07-14 |
| ID1 EUV Photolithography Senior Process Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Wafer Probe Integration Engineer | Micron Technology | Boise, United States | 2026-07-14 |
| Technician, Product Development Engineering | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Design Engineer - DRAM Technology and Products | Micron Technology | Boise, United States | 2026-07-14 |
| Hardware Engineer โ DMTS/SMTS/MTS/Principal Engineer | Micron Technology | United States | 2026-07-14 |
| SR ENGINEER, FAC MECHANICAL | Micron Technology | Singapore, Singapore | 2026-07-14 |
| Staff/Principal Engineer, Operations Central Team Dry Etch Tool Installation Qualification | Micron Technology | Hiroshima, Japan | 2026-07-14 |
| Principal Analog Design Engineer | Micron Technology | Boise, United States | 2026-07-14 |