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SP500402,069SP40092,553SP10088,416SP60061,089CAC4057,810DAX47,500FTSE 10045,124SBF 12019,024OMXS3014,625SMI13,181FTSE 25011,762MDAX9,278OMXC259,228AEX9,220IBEX 358,957TecDAX5,313FTSE MIB5,276OMXH253,842AMX3,706SDAX2,836S&P/ASX 2002,643ATX1,719BEL201,542WIG201,403PSI1,383LuxX1,212OBX1,193ATHEX1,148ISEQ 20875IBEX Medium Cap626TASE โ€” IL524BUX425OMXV232ADX/DFM โ€” UAE163BME Growth156PX78Tadawul โ€” SA67S&P/NZX 5044QSE โ€” QA14OMXT10CROBEX9AScX5SP500402,069SP40092,553SP10088,416SP60061,089CAC4057,810DAX47,500FTSE 10045,124SBF 12019,024OMXS3014,625SMI13,181FTSE 25011,762MDAX9,278OMXC259,228AEX9,220IBEX 358,957TecDAX5,313FTSE MIB5,276OMXH253,842AMX3,706SDAX2,836S&P/ASX 2002,643ATX1,719BEL201,542WIG201,403PSI1,383LuxX1,212OBX1,193ATHEX1,148ISEQ 20875IBEX Medium Cap626TASE โ€” IL524BUX425OMXV232ADX/DFM โ€” UAE163BME Growth156PX78Tadawul โ€” SA67S&P/NZX 5044QSE โ€” QA14OMXT10CROBEX9AScX5
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โ† Semiconductors overview

14,689 open jobs โ€” Semiconductors

Every open role at organisations of this kind, newest first. Each links to the employer's own career site.

All rolesEngineering & R&D (14,689)Software & IT (4,090)Production & Operations (2,192)Other Management/Specialist (1,242)Supply Chain & Logistics (825)Project & Product (604)Sales & Business Dev (496)Finance & Accounting (409)Internship & Graduate (326)Marketing & Comms (310)Management & Exec (254)HR & People (250)
RoleEmployerPlacePosted
Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) EngineerMicron TechnologySingapore, Singapore2026-07-14
Senior Engineer, Process IntegrationMicron TechnologySingapore, Singapore2026-07-14
Sr Engineer, Process Development, Cell Film , Advance NANDMicron TechnologySingapore, Singapore2026-07-14
Staff Engineer of Chemical Expert, Global Facilities North AsiaMicron TechnologyUnited States2026-07-14
QE DMS EngineerMicron TechnologyTaichung, Taiwan2026-07-14
Principal/Sr/Staff BEOL Engineer, DRAM PIMicron TechnologyHiroshima, Japan2026-07-14
Principal TCAD Device EngineerMicron TechnologyBoise, United States2026-07-14
Principal Node Development Product Engineer, DPAGMicron TechnologyBoise, United States2026-07-14
QE PCT STAFF ENGINEER/SR ENGINEER, OMT_TYMicron TechnologyTaoyuan, Taiwan2026-07-14
Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product EngineeringMicron TechnologySingapore, Singapore2026-07-14
RDA Application EngineerMicron TechnologyMiaoli, Taiwan2026-07-14
Fab16 RDA Operation EngineerMicron TechnologyMiaoli, Taiwan2026-07-14
Staff Engineer - Analog LayoutMicron TechnologyBengaluru, India2026-07-14
Staff Engineer - Analog LayoutMicron TechnologyBengaluru, India2026-07-14
NAND Cell Device Senior/Principle EngineerMicron TechnologySingapore, Singapore2026-07-14
Staff Equipment Development Engineer - Advanced PackagingMicron TechnologyBoise, United States2026-07-14
Tongluo Contamination Control Night Shift EngineerMicron TechnologyMiaoli, Taiwan2026-07-14
Tongluo Contamination Control Night Shift EngineerMicron TechnologyMiaoli, Taiwan2026-07-14
Engineer/Senior Engineer in Product Engineering, NAND Validation/CharacterizationMicron TechnologySingapore, Singapore2026-07-14
Engineer, IE ModelingMicron TechnologyUnited States2026-07-14
Staff Engineer, TEMMicron TechnologySingapore, Singapore2026-07-14
Probe Integration Engineer (Test Solutions Engineering)Micron TechnologySingapore, Singapore2026-07-14
Engineer, Product Development Engineering Key Equipment Group (PDE KEG)Micron TechnologySingapore, Singapore2026-07-14
Senior DRAM Product EngineerMicron TechnologyManassas, United States2026-07-14
MTB PROCESS INTEGRATION ENGINEERMicron TechnologyTaichung, Taiwan2026-07-14
CAD EngineerMicron TechnologyRichardson, United States2026-07-14
Staff NAND Reliability Product EngineerMicron TechnologySingapore, Singapore2026-07-14
Staff NAND Reliability Product EngineerMicron TechnologySingapore, Singapore2026-07-14
FE CPIE PI Principal/Staff EngineerMicron TechnologyBoise, United States2026-07-14
EHS Safety Engineer - FacilityMicron TechnologyHiroshima, Japan2026-07-14
EHS Safety Engineer - EquipmentMicron TechnologyHiroshima, Japan2026-07-14
HBM SIPI, Principal EngineerMicron TechnologyUnited States2026-07-14
HBM SIPI, Staff EngineerMicron TechnologyUnited States2026-07-14
Staff DRAM RTL design engineerMicron TechnologyHyderabad, India2026-07-14
HBM Talent Pool โ€“ Engineering, Manufacturing & Facilities (HBMไบบๆ‰ๅฐˆๅ€-ๅฐไธญๅŽ้‡Œ)Micron TechnologyUnited States2026-07-14
Senior Engineer - HBM Circuit VerificationMicron TechnologyHyderabad, India2026-07-14
F16N Equipment EngineerMicron TechnologyMiaoli, Taiwan2026-07-14
Sr Engineer, Firmware Development (SSD)Micron TechnologySingapore, Singapore2026-07-14
TF OPERATION PRPOCESS ENGINEERMicron TechnologyTaichung, Taiwan2026-07-14
SR ENGINEER, APTD Wafer Thinning / CMP processMicron TechnologyTaichung, Taiwan2026-07-14
Engineer, MTB PWF THINNING PROCESSMicron TechnologyTaichung, Taiwan2026-07-14
Engineer, MTB PWF Thinning EQUIPMENTMicron TechnologyTaichung, Taiwan2026-07-14
Test Solutions EngineerMicron TechnologyHyderabad, India2026-07-14
Engineer, MTB THINNING EQMicron TechnologyTaichung, Taiwan2026-07-14
Senior Engineer, DesignMicron TechnologyHyderabad, India2026-07-14
Manager - AutomationMicron TechnologyAustria2026-07-14
Technician - Global Engineering LabsMicron TechnologySingapore, Singapore2026-07-14
Environment Health Safety Engineer - SafetyMicron TechnologyUnited States2026-07-14
Senior Engineer/Staff/Principal Engineer, CPIE RAM Detection StrategyMicron TechnologyBoise, United States2026-07-14
ENGINEER, HVM PEE CV/PV PRMicron TechnologyHiroshima, Japan2026-07-14
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