| Tool Install Area Coordinator | Intel | Albuquerque, United States | 2026-07-24 |
| Substrates HVM Engineer | Intel | China | 2026-07-24 |
| Install Qualification Operations Specialist | Intel | Phoenix, United States | 2026-07-24 |
| Sr. Logic Design Engineer | Intel | United States | 2026-07-24 |
| DDR PHY Firmware Engineer | Intel | Guadalajara, Mexico | 2026-07-24 |
| Accountant | Intel | Malaysia | 2026-07-24 |
| Accountant | Intel | Malaysia | 2026-07-24 |
| Module Engineer | Intel | Malaysia | 2026-07-24 |
| Substrate Supplier Enablement Engineer | Intel | Seoul, South Korea | 2026-07-24 |
| Senior SoC Design Verification Engineer | Intel | United States | 2026-07-24 |
| Consumer Client Partner Marketing Strategy Manager | Intel | Austin, United States | 2026-07-24 |
| Software Development Engineer | Intel | Malaysia | 2026-07-24 |
| Senior Software Development Engineer | Intel | Malaysia | 2026-07-24 |
| Industrial Security Representative1 | Intel | Santa Clara, United States | 2026-07-24 |
| Treasury Analyst Intern | Intel | San Josรฉ, Costa Rica | 2026-07-24 |
| AI Compiler and Library Engineer | Intel | Shanghai, China | 2026-07-24 |
| AI Software Solutions Engineer | Intel | Shanghai, China | 2026-07-24 |
| Non Tech Student for Project Management โ Government, Policy & Community Group | Intel | Haifa, Israel | 2026-07-24 |
| Executive Assistant Intern | Intel | Beijing, China | 2026-07-24 |
| CPU Circuit Design Lead | Intel | Bengaluru, India | 2026-07-24 |
| Backend STA Engineer | Intel | Haifa, Israel | 2026-07-24 |
| CPU Core Logic Designer | Intel | Folsom, United States | 2026-07-24 |
| Graduate Talent (CPU Design Verification) | Intel | Malaysia | 2026-07-24 |
| CPU Core Pre-Si Validation/Verification Engineer | Intel | Folsom, United States | 2026-07-24 |
| IP Design Verification Engineer | Intel | Santa Clara, United States | 2026-07-24 |
| Advanced Packaging Singulation Engineer | Intel | Albuquerque, United States | 2026-07-24 |
| Advanced Packaging Metro Module Engineer | Intel | Albuquerque, United States | 2026-07-24 |
| SoC Design Engineering Manager | Intel | Bengaluru, India | 2026-07-24 |
| Senior Physical Design Engineer | Intel | Bengaluru, India | 2026-07-24 |
| Graduate Talent (Physical Design Engineer) | Intel | Malaysia | 2026-07-24 |
| Debug Engineer | Intel | United States | 2026-07-24 |
| Manufacturing Operator (Contract) | Intel | Malaysia | 2026-07-24 |
| Graduate Talent (PDK QA Engineer) | Intel | Malaysia | 2026-07-24 |
| Graduate Talent (Standard Cell Library Design Engineer) | Intel | Malaysia | 2026-07-24 |
| Signal Integrity Engineer | Intel | Oregon, United States | 2026-07-24 |
| Kubernetes Platform Architect | Broadcom | United States | 2026-07-24 |
| Finance & Payroll Analyst | Broadcom | Singapore, Singapore | 2026-07-24 |
| Product Marketing Engineer | Broadcom | Regensburg, Germany | 2026-07-24 |
| IC Designer Analog Mixed-Signal ASICs (f/m/d) | Broadcom | Austria | 2026-07-24 |
| SerDes Application Engineer | Broadcom | San, Mali | 2026-07-24 |
| Partner Manager | Broadcom | Germany | 2026-07-24 |
| R&D Engineer SW Quality 3 | Broadcom | Broomfield, United States | 2026-07-24 |
| Wafer Fab Process Engineer | Broadcom | Singapore, Singapore | 2026-07-24 |
| Wafer Fab Process Engineer | Broadcom | Singapore, Singapore | 2026-07-24 |
| Analog/Mixed Signal IC Design Engineer (Principal/Staff) | Broadcom | Singapore, Singapore | 2026-07-24 |
| IC design Engineer | Broadcom | Bengaluru, India | 2026-07-24 |
| IC Design Engineer | Broadcom | Bengaluru, India | 2026-07-24 |
| R&D Engineer | Broadcom | Bengaluru, India | 2026-07-24 |
| R&D Engineer Software 3 | Broadcom | Lisle, United States | 2026-07-24 |
| Mainframe Cybersecurity Software Engineer (ICB 5) | Broadcom | Plano, United States | 2026-07-24 |