| Field Process Engineer 3 | Lam Research | Hsinchu | 2026-07-31 |
| Process Engineer 2 | Lam Research | Hsinchu | 2026-07-31 |
| Imaging Engineer | Logitech | Hsinchu | 2026-07-29 |
| Expert Simulation Engineer - CFD and FEA | Logitech | Hsinchu | 2026-07-29 |
| Sustainability Process Engineering Specialist | Logitech | Hsinchu | 2026-07-29 |
| Lead Electrical Engineer | Logitech | Hsinchu | 2026-07-29 |
| Hardware & Silicon Validation, Senior Staff Engineer | Marvell Technology | Hsinchu | 2026-07-29 |
| Staff Applications Engineer | Onto Innovation | Hsinchu | 2026-07-29 |
| Staff Applications Engineer | Onto Innovation | Hsinchu | 2026-07-29 |
| Senior Applications Engineer | Onto Innovation | Hsinchu | 2026-07-29 |
| Field Service Engineer 1 | Merck KGaA | Hsinchu | 2026-07-29 |
| Field Service Engineer 1 1 | Merck KGaA | Hsinchu | 2026-07-29 |
| CS - Application Engineer (YS) - Hsinchu | ASML | Hsinchu | 2026-07-25 |
| Test Engineer | AMD | Hsinchu | 2026-07-25 |
| Production Test Engineer | Monolithic Power Systems | Hsinchu | 2026-07-24 |
| Field Service Engineer 2 | Lam Research | Hsinchu | 2026-07-24 |
| Field Service Engineer 2 | Lam Research | Hsinchu | 2026-07-24 |
| Field Service Engineer 2 | Lam Research | Hsinchu | 2026-07-24 |
| Field Service Engineer 2 | Lam Research | Hsinchu | 2026-07-24 |
| Regional Development Applications Engineer | KLA Corporation | Hsinchu | 2026-07-24 |
| Product Development Engineer | KLA Corporation | Hsinchu | 2026-07-24 |
| Sr. EHS Engineer | KLA Corporation | Hsinchu | 2026-07-24 |
| Technical Product Support Engineer II - (E2) - CMP | Applied Materials | Hsinchu | 2026-07-24 |
| Product Engineer II | Cadence Design Systems | Hsinchu | 2026-07-24 |
| Principal Product Engineer | Cadence Design Systems | Hsinchu | 2026-07-24 |
| Production Engineer | Air Products | Hsinchu | 2026-07-24 |
| Senior Manager, Applications Engineering | Onto Innovation | Hsinchu | 2026-07-24 |
| Staff Applications Engineer | Onto Innovation | Hsinchu | 2026-07-24 |
| Senior Applications Engineer | Onto Innovation | Hsinchu | 2026-07-24 |
| Senior Applications Engineer | Onto Innovation | Hsinchu | 2026-07-24 |
| ๅฐ็ฎกๅทฅ็จๅธซ / ๅฐ็ฎกๅฉ็(ๆฐดๅ้จโๆฐ็ซนๅๅฏฎ)hybrid | AECOM | Hsinchu | 2026-07-24 |
| Product Test Engineer - Digital Processors and Sensors characterization, up to Staff | Qualcomm | Hsinchu | 2026-07-24 |
| Test Engineer โ DDR ATE Test Development & Characterization, Engineer to Senior Engineer | Qualcomm | Hsinchu | 2026-07-24 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-24 |
| Test Engineer | AMD | Hsinchu | 2026-07-24 |
| Sr. Test Engineer | AMD | Hsinchu | 2026-07-24 |
| Sr. RF Systems Engineer | Amazon | Hsinchu | 2026-07-24 |
| EHS Engineer - SI EA (Hsinchu) | Siemens AG | Hsinchu | 2026-07-24 |
| Field Service Engineer 3 | Lam Research | Hsinchu | 2026-07-20 |
| TW Engineer - FP II, TF | Lam Research | Hsinchu | 2026-07-20 |
| MBIST Diagnostics Engineer, up to Sr. Staff | Qualcomm | Hsinchu | 2026-07-20 |
| Packaging Engineer | AMD | Hsinchu | 2026-07-20 |
| USB IP Verification Engineer | AMD | Hsinchu | 2026-07-20 |
| Product Test Engineer | Silicon Laboratories | Hsinchu | 2026-07-20 |
| Product Test Engineer | Silicon Laboratories | Hsinchu | 2026-07-20 |
| Senior Application Engineer | Element Solutions | Hsinchu | 2026-07-20 |
| MOSFET Development Engineer | Littelfuse | Hsinchu | 2026-07-20 |
| Applications Engineer, 3D-IC Solution Sales | Siemens AG | Hsinchu | 2026-07-20 |
| Product Applications Engineer | Veeco Instruments | Hsinchu | 2026-07-17 |
| Staff Packaging Engineer - Process Package Integrity & Bumping | Qualcomm | Hsinchu | 2026-07-17 |