| IC Package Layout Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| 3DIC Yield Analytics & Diagnostics Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| ASICS Design Engineer, Principal Manager | Qualcomm | Hsinchu | 2026-07-14 |
| Thermal Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Package/System Design Engineer (PMIC SIP and Module) | Qualcomm | Hsinchu | 2026-07-14 |
| Alpha Wave IPG Tech Silicon Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| Baseband Design Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| Customer Quality Engineer, Staff | Qualcomm | Hsinchu | 2026-07-14 |
| SLT Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| Central Hardware Systems โ EE Automation Engineer, Senior | Qualcomm | Hsinchu | 2026-07-14 |
| New Product Introduction (NPI) and Return Material Authorization (RMA) Engineer | Qualcomm | Hsinchu | 2026-07-14 |
| Data Analytics Director, Engineering (Zhubei) | Qualcomm | Hsinchu | 2026-07-14 |
| Digital Product and Test Development Engineer, up to Senior | Qualcomm | Hsinchu | 2026-07-14 |
| Senior AI Engineer โ Depth Estimation and Dense Scene Understanding | Qualcomm | Hsinchu | 2026-07-14 |
| Clinical Research Associate I | AbbVie | Taipei | 2026-07-14 |
| Silicon Design Engineer (SMT Process) | AMD | Taipei | 2026-07-14 |
| Packaging Engineer (CPO) | AMD | | 2026-07-14 |
| Analog/Mixed-signal SerDes Design Engineer | AMD | Taipei | 2026-07-14 |
| Analog/Mixed-signal SerDes Design Engineer | AMD | Taipei | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Director, Customer Engineering, Compute and Enterprise AI | AMD | Taipei | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Thermal Mechanical Engineer (Datacenter Platform) | AMD | Taipei | 2026-07-14 |
| Director, Silicon Design Engineering | AMD | Hsinchu | 2026-07-14 |
| Server BIOS Engineer | AMD | Taipei | 2026-07-14 |
| Sys/Test Validation Engineer | AMD | Taipei | 2026-07-14 |
| Sys/Test Validation Engineer | AMD | Taipei | 2026-07-14 |
| Product Application Engineer | AMD | Taipei | 2026-07-14 |
| Manufacturing Operation Engineer (Datacenter Platform) | AMD | Taipei | 2026-07-14 |
| Manager Packaging Engineering | AMD | | 2026-07-14 |
| Packaging Engineer (based in Kaohsiung) | AMD | | 2026-07-14 |
| Customer Debug Engineer (Datacenter Platform) | AMD | Taipei | 2026-07-14 |
| UEFI/BIOS Firmware Engineer | AMD | Taipei | 2026-07-14 |
| Sr. Thermal Engineer - Manufacturing | AMD | | 2026-07-14 |
| Packaging Engineer | AMD | Taichung | 2026-07-14 |
| Signal Integrity Validation Engineer | AMD | Taipei | 2026-07-14 |
| Sr. Test Engineer | AMD | Taipei | 2026-07-14 |
| Sr. Analog Designer | AMD | Taipei | 2026-07-14 |
| Sr. Analog Designer | AMD | Taipei | 2026-07-14 |
| Sr. Analog Designer | AMD | Taipei | 2026-07-14 |
| Programmable Logic Engineer (FPGA Execution) | AMD | Taipei | 2026-07-14 |
| Packaging Engineer | AMD | Hsinchu | 2026-07-14 |
| Product Development Engineer | AMD | Hsinchu | 2026-07-14 |
| Systems Design Engineer | AMD | Taipei | 2026-07-14 |
| BMC Firmware Engineer (Server) | AMD | Taipei | 2026-07-14 |
| BMC Firmware Engineer | AMD | Taipei | 2026-07-14 |
| PC Board Design Engineer | AMD | Taipei | 2026-07-14 |
| PC Board Design Engineer | AMD | Taipei | 2026-07-14 |
| Sr. Systems Design Engineer | AMD | Taipei | 2026-07-14 |
| Sr. Systems Design Engineer | AMD | Taipei | 2026-07-14 |